On August 18-19, the 13th Huanyu Semiconductor Chip Technology Seminar took place in Jinhua, organized by Huanyu Enterprise Group. Leading experts from around the country and outstanding entrepreneurs gathered to explore new paths for the development of domestic semiconductor technology, under the theme “Focusing on Localization and Leading the Future of Chips.”

Over 300 experts and business representatives toured the Yuxin integrated circuit chip production line and Huanyu Technology Core City. They sought to understand the various stages of integrated circuit chip creation, including design, wafer manufacturing, testing, and packaging. They also learned about Huanyu Enterprise Group’s plans for industry development in Jinhua. During the subsequent seminar on semiconductor localization, industry experts delved into technical requirements and market demands for domestic semiconductor chip production. They discussed overcoming technical barriers and shared insights into cutting-edge technologies and trends, sparking enthusiastic responses from participants. Attendees praised the event for offering a platform that enabled face-to-face dialogue and collaboration on technology, projects, and talent, emphasizing their commitment to strengthening collaboration with Huanyu Enterprise Group to contribute to semiconductor chip localization.

“The domestic semiconductor chip production is in its early phase, and innovation takes time,” noted Zhang Ya, president of Huanyu Enterprise Group. The seminar aimed to gather collective efforts, strengthen industry cooperation, overcome technical barriers, accelerate progress, promote industry clustering and standardization, and foster a collaborative effort for innovative growth.

Since initiating the highly reliable integrated circuit process line project in Jinhua Development Zone, Huanyu Enterprise Group progressed from testing to producing chips in just 4 months. They developed Jinhua’s first planar type high-reliability 650V MOSFET chip. Zhang Ya expressed that with Huanyu Technology Core City’s support, the group will continue industry development, nurture growth, and strengthen the platform. This commitment aims to consistently advance Jinhua’s semiconductor chip industry. (By Zhou Yao)

8月18-19日，由环宇企业集团主办的“聚焦国产化，引领芯未来”第十三届环宇半导体芯片技术研讨会在金华举行，来自全国的顶尖行业专家和优秀企业家代表，齐聚一堂、共襄盛举，共同研究探索半导体国产化技术发展新路径，助推金华半导体芯片产业高质量发展。

300余名专家和企业家代表们一起参观宇芯集成电路芯片生产线和环宇科技芯城，了解集成电路芯片设计、晶圆制造、封装测试等工艺环节，以及环宇企业集团在金华的产业布局、发展规划等情况。在随后举行的半导体国产化研讨交流会上，行业专家们围绕半导体芯片国产化的技术要求、市场需求，就如何突破技术壁垒等方面进行了深入交流，为大家分享并探讨了相关前沿技术与趋势，受到了与会人员的高度关注并引起热烈反响。“这次活动搭建了技术、项目、人才面对面的交流合作平台，是一场高规格、高水准的行业盛会。”与会人员纷纷表示，将继续加强与环宇企业集团的交流合作，加快培育自主研发能力，为半导体芯片国产化作应有贡献。

“半导体芯片国产化正处于发展初期，创新突破不是一蹴而就的。”环宇企业集团总裁张亚表示，举办此次研讨会的目的，就是为了汇聚各方力量协同攻关，强化行业合作，不断突破技术壁垒，加快产业与技术迭代，促进集群化与标准化建设，不断凝聚创新发展的强大合力。

据悉，环宇企业集团将高可靠集成电路工艺线项目落地金华开发区以来，仅用了4个月就实现从工艺线试流片到成功出片，研制出金华首个平面型高可靠性650VMOSFET功率芯片，打响了“中国芯，金开造”的第一枪，为金华“芯制造”实现了零的突破。张亚表示，未来，环宇企业集团将以环宇科技芯城为支撑，继续扎根开发区，深耕行业、厚植产业、壮大平台，不断助推金华半导体芯片产业取得更大的突破发展。（记者 周垚）